By PNY Technologies AI agents, digital twins, spatial computing, simulation, and industrial automation are coming together faster than ever reshaping how manufacturers design, build, and deliver. To ...
A unique thermal-management device keeps optical components at a known, stable temperature and is key to their consistent ...
Silicon Labs used its Works With Summit in Austin to announce three developer initiatives: a public beta of its Simplicity AI ...
Teradyne has announced the UltraFLEXplus S series, beginning with the 24-slot UltraFLEXplus S24 system for engineering and ...
TDK Corporation announces worldwide distribution of its InvenSense PositionSense™, a two-chip nine-axis sensor solution ...
Stackpole Electronics has expanded its CSSU series of high-power metal-alloy current-sense resistors with 25 mΩ and 30 mΩ ...
As AI moves further into engineering workflows, knowing what it can do is only part of the challenge. The bigger question is ...
Navitas Semiconductor has introduced a 24 kW, 800 VDC-to-12 VDC power delivery board (PDB) for NVIDIA MGX AI data center ...
AI may be able to speed up the design of a test system, but faster design also raises a bigger question: how do engineers ...
Advantech’s AOM-2721 Open Standard Module (OSM) is now certified for Ubuntu 24.04 LTS. The module passed hardware ...
AI workloads, particularly large‑scale training and distributed inference, place unique demands on data center fabrics. While ...
Nuvoton has introduced the NAU85L42YG, a quad audio ADC for wireless streaming and real-time voice capture applications. The ...
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