This year’s Nobel prizes linked large systems to their smallest parts. What can chip design learn, and can AI help reverse ...

A trillion-dollar industry driven by AI and quantum computing, with Zeiss inspection tech and advanced packaging innovations.

Explore OCP Global Summit 2026 breakthroughs: high-voltage 800 V DC-to-12 V power boards, advanced server PSUs, and isolated ...

At Ayar Labs CPO Summit, Meta, Broadcom, AMD, and others weighed in on readiness for a 2028 co-packaged optics demand surge ...

GlobalFoundries secures a $21B U.S.-Japan partnership to build two New York fabs, boosting U.S. chip production by 10% amid ...

Automotive executives and AI developers are reassessing the plans to bring automated driving systems to everyday vehicles.

Fraunhofer manufactures specialized chips in small volumes that help IMS systems produce photomasks for advanced ...

Swissbit and Fraunhofer target Europe’s advanced packaging gap, bridging research and low-volume industrial production.

Track energized compute, not gigawatts, as AI data centers face delays in memory, networking, cooling, and power.

In a bid to secure domestic deep-tech infrastructure, Qilimanjaro closed €19.6 million (~$21.3 million) funding led by Indra ...

Learn how Europe’s Cyber Resilience Act (CRA) forces chipmakers to adopt automated verification tools to prove silicon ...

Applied Materials launched its $5B EPIC Center in Silicon Valley to unite chipmakers and accelerate AI semiconductor R&D by ...