Targeted enclosure upgrades can help engineers improve shielding above 40GHz while preserving existing cabinet architecture ...

AST's 95,000-square-meter plant will produce large-body, high-layer-count substrates for AI computing and networking chips.

TSMC turns to GlobalFoundries for silicon interposers to expand advanced packaging capacity and support future customer ...

OLED notebook panel shipments are forecast to rise 50% in 2026, driven by premium PCs, Apple adoption and manufacturing ...

Nordic's Bluetooth LE SoCs have powered the educational board since 2016, reaching 73.5 million young people across more than ...

UVJC’s first commercial vapor jet printing system targets materials development and process validation for advanced ...

FICG's Johor site operates eight SMT lines and will produce high-speed optical transceivers for AI infrastructure and data centers.

Stronger-than-expected growth momentum for Meta’s Ray-Ban Display glasses has drawn more consumer attention to AR glasses, ...

TI's latest ADC captures transient power faults, while new power-management and timing devices target AI data center ...

The software connects Tessent-generated test patterns with execution environments, including automated test equipment, system ...

Flip Electronics's authorized distribution agreement with Synaptics covers embedded computing, wireless connectivity and ...

Cellid will use Qualcomm's development platform to build reference designs and shorten AR glasses development cycles.